Test and inspection methods are undergoing rapid change. In this issue, we consider the influence of AOI, AI, and human eyes. How exactly are these pieces of the puzzle changing the role of test and inspection?
In Europe and the U.S., legislation is under way to revitalize PCB fabrication and packaging. What is the status of this work, and how specifically does this change the industry landscape for EMS companies? What will help keep us afloat? Smd Placement Machine
The opportunity to use manufacturing simulation as a test bed for job planning and process optimization brings continuous improvement into the modern age. This may be an all-or-nothing type of project, but it’s worth the investment.
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Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, is proud to present the new 3D solder paste inspection (SPI) solution TR7007D/Q Plus.
The TR7007D/Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCat) and an enhanced 2D light module. The new motion controller achieves real-time measurements and processing on the fly while the new light module realizes higher uniformity inspection, less shadow, and improved imaging.
Pick And Place Gripper The TR7007D/Q Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/Q Plus is equipped with up to four projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.